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3D Heterogeneous Integration Development Intern (Summer 2027)

GlobalFoundries

Malta · Posted Oct 09 · $20-$40/hr

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At a glance

Pay
$20-$40/hr
Location
Malta, NY
Work type
Onsite
Start
Summer 2027

The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies.

What they are looking for

Design of experimentsSemiconductor packagingHybrid bondingTsvInterposers

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