Advanced Packaging Integration and Simulation Intern at Intel Technology Research focused on wafer-level and 2.5D/3D integration, DOE development, and package modeling. Responsibilities include thermo-mechanical simulations, data analysis, and collaboration with cross-functional teams; 3-month internship in the US (Phoenix, AZ and Hillsboro, OR) under a hybrid work model.
What they are looking for
Details
- Work type
- Hybrid
- Compensation
- Paid
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