HP

College Intern - Packaging Engineering

HP

Singapore · Posted Aug 26

Engineering Onsite
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College Intern - Packaging Engineering role at HP in Singapore. Five to six month full-time internship starting January 2027. Responsibilities include supporting packaging design and development, validation and testing, data analysis, documentation, sustainability initiatives, and cross-functional collaboration across Quality, Manufacturing, Procurement, Marketing, and NPI teams.

What they are looking for

Excel Powerpoint Word Solidworks Creo

Details

Work type
Onsite
Remote eligible
No

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