AP

College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)

Applied Materials

Singapore · Posted Sep 07

Product Design Onsite
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College Intern focused on PVD process and product development for hybrid bonding in SOIC advanced packaging; responsibilities include PVD process optimization, measuring metal film properties, hardware characterization, and participating in root-cause analysis under engineer guidance. Location: Singapore.

What they are looking for

Pvd Hardware characterization Root cause analysis Data analysis Process optimization

Details

Work type
Onsite
Remote eligible
No

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