College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)
Applied MaterialsSingapore · Posted Sep 07
College Intern focused on PVD process and product development for hybrid bonding in SOIC advanced packaging; responsibilities include PVD process optimization, measuring metal film properties, hardware characterization, and participating in root-cause analysis under engineer guidance. Location: Singapore.
What they are looking for
Details
- Work type
- Onsite
- Remote eligible
- No
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