Hardware Engineering Intern, PhD, Summer 2026

Location: Taipei, Taiwan

Join us for a unique 10-12 week paid internship that offers personal and professional development, an executive speaker series, and community-building.

As a Hardware Engineering Intern, you will develop system and subsystem boards for next generation server and storage products. The teams you work with design, develop, and deploy next generation server and storage machine products while ensuring that this equipment is reliable. You’ll work closely with engineers to improve our hardware to meet Google's standards of quality and reliability, and your work has the potential to impact many of Google users.

Google is and always will be an engineering company. We hire people with a broad set of technical skills who are ready to address some of technology's greatest challenges and make an impact on millions, if not billions, of users. At Google, engineers not only revolutionize search, they routinely work on massive scalability and storage solutions, large-scale applications and entirely new platforms for developers around the world. From Google Ads to Chrome, Android to YouTube, Social to Local, Google engineers are changing the world one technological achievement after another.

Responsibilities may vary based on specific teams.

Synthesize findings to accelerate BGA rework process optimization, supporting ML ramp expansion and ensuring hardware product reliability.

Develop localized PCB warpage modeling and identify options for optimizing the simulation meshing process.

Work with Google platform teams and cross-functional teams on new technology and solutions.

Minimum qualifications

Currently pursuing a PhD degree in Reliability Engineering, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field.

Preferred qualifications

Currently attending a degree program in Taiwan and available to work full time for 12 weeks outside of university term time.

Penultimate academic year or returning to a degree program after completion of the internship.

Experience with hardware engineering concepts, specifically microelectronics packaging or printed circuit board assembly (PCBA) manufacturing.

Experience with data analysis, 3D modeling, or mechanical simulation tools.

Experience using Ansys (APDL, Workbench, Icepak) for thermomechanical modeling and simulation.

Familiarity with test, validation, and materials characterization tools such as Shadow Moiré, TMA, or DMA.