Develop new package type and package structure. Responsibilities include surveying new materials to meet package processes, reliability, and cost requirements; collecting packaging information/requirements from TME/DE/Marketing/Competitor for next generation package development; summarizing the experience of package design & process and maintaining package design rules & updating package road map; qualifications: Doctoral degree in Package or Power Electronics; good knowledge of package development principles; knowledge of semiconductor supply chain; fluent in English; familiarity with AutoCAD or Cadence is a plus.
What they are looking for
Details
- Work type
- Onsite
- Remote eligible
- No
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