AP

Process Engineering Intern (Hybrid Bonding)

Applied Materials

Singapore · Posted Aug 31

Engineering Onsite
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Process Engineering Intern (Hybrid Bonding) in Singapore. Full-time internship for intern/student; field of work includes advanced packaging - hybrid bonding system development; exposure to metrology & inspection tools and cleanroom environment; responsibilities include design, data collection, analysis, and reports on entry-level experiments, and supporting tool development, DOE execution, data analysis; priority consideration to join core development team after graduation.

Details

Work type
Onsite

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