Systems Intern - Validation, Software, Design, Architecture & Packaging (USA)

Location: Austin, Texas, United States; Santa Clara, California, United States Department: University

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Overview: A chip isn't a product until it's a working system. These teams cover both ends of that: getting silicon to boot and validate correctly,building the board, power, mechanical, thermal, packaging and IO around it. You submit one application, you have one recruiter screen - then we match you to the specific team below and location that fits best.

Systems & Silicon Validation: Post-silicon testing of physical chips and integrated systems to ensure they meet all functional, electrical, and performance specs.

System Software: Development of foundational software, including firmware, drivers, and operating systems, that directly controls and interfaces with hardware.

System Design: The process of defining, integrating, and mapping out hardware components such as PCBs, software modules, and interfaces into a complete product blueprint.

System Architecture: Define the high-level structural framework, interfaces, and data-flow pathways between the CPU, memory, and peripherals.

Packaging: A package is what is placed between the silicon and the board; and its design requires detailed electrical, electromagnetic, and mechanical simulations and analysis.

This role is on-site, based out of Austin, TX or Santa Clara, CA.

Who You Are

Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering

Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).

Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.

Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).

What We Need

Systems & Silicon Validation: Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications.

System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware.

System Design & Architecture: Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs.

Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis

What You Will Learn

Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips.

Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal.

Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages.

Cross-functional collaboration working alongside world-class architects, mechanical designers, package engineers, and software teams to understand how complex, large-scale chip ecosystems are built from scratch.

USA Hiring Timelines

This internship opportunity is available throughout our 3 terms with the following corresponding recruitment cycles:

Winter Term: Jan–Apr work term, Sept–Dec recruit.

Summer Term: May–Aug work term, Oct–Apr recruit.

Fall Term: Sept–Dec work term, Jan–Aug recruit.

Please note these timelines are for reference only. Actual timelines may vary.

Compensation for all interns at Tenstorrent ranges from $50/hr - $70/hr including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.