Thesis: DUV-Assisted Athermal Laser Grooving of Low-κ Dielectrics for Advanced Packaging
FraunhoferAachen · Posted Jun 29
Thesis opportunity with Fraunhofer ILT in Aachen, Germany to study DUV-assisted athermal laser grooving of low-k dielectrics for advanced packaging. Responsibilities include literature review on laser–material interaction in nanoporous low-k dielectrics; set up and align the dual-pulse optical arrangement (DUV pump + 515 nm ablation pulse); pump-probe characterization of transient optical properties after DUV excitation; and investigating dual-pulse ablation in low-k/Si layer systems. The position is a practice-oriented thesis in an innovative applied research environment and duration is limited to completion of the thesis.
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