2026 Intern-Modem Firmware DSP Engineer

Location: Beijing, China Department: Interim Engineering Intern - SW

Company

Qualcomm China

Job Area:Interns Group, Interns Group > Interim Engineering Intern - SW

General Summary

Candidates will participate in the design, implementation, and commercialization of modem physical layer firmware (fixed point) algorithms and control code. In addition, candidates will have the opportunity to contribute to the architectural design and evolution of current and next generation wireless modem technologies.

Candidate will design, implementation, maintain firmware internal tools which helps firmware team development and verifications.

The modem firmware team works closely with Qualcomm's world class modem systems and ASIC engineering teams to design, implement, and optimize our current modem products while also influencing the evolution of their design and inspiring the Qualcomm products of the future.

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