College/University Intern in Engineering at HP attached to Smart Manufacturing. Responsibilities include process and equipment follow-up; improving process and tooling performance (quality, yield, machine uptime, process characterization, OEE, throughput); product failure analysis or product testing; process/product characterization or improvements; innovations in manufacturing technology in line with Industrial 4.0. Open to bachelor’s students in Mechanical, Electronic/Electrical, Mechatronic, Manufacturing or Material Science. Internships begin after Nov 2026 or in 2027. Location: Batu Kawan, Penang, Malaysia. Schedule: Full-time; shift: none. HP is an equal opportunity employer.
Details
- Work type
- Onsite
- Remote eligible
- No
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