College Intern – R&D Mechanical Engineer at HP Singapore. Internship (full-time) from January 2027 for 5-6 months. Role involves CAD-based mechanical design of printer components, documenting design rules, running simulations and AI-assisted analyses to assess design robustness, and developing test specifications to maximize yield and minimize cycle time.
What they are looking for
Details
- Work type
- Onsite
- Remote eligible
- No
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