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Intern - Process Integration, Advanced Packaging

Micron Technology

Main Site · Posted Nov 03

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At a glance

Location
Main Site, United States
Work type
Onsite

Intern - Process Integration, Advanced Packaging at Micron Technology in Boise, ID. Work with engineers to support development of interconnect technologies, engage inDesign of Experiments (DoE), line monitoring, yield improvement, data analysis, and use of AI tools to maximize learning.

What they are looking for

DoeKtJmpData analysisAi tools

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