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Intern - Process Integration, Advanced Packaging

Micron Technology

Main Site · Posted Nov 04

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At a glance

Location
Main Site, United States
Work type
Onsite

Intern - Process Integration, Advanced Packaging at Micron Technology in Boise, Idaho. The role supports development of interconnect technologies, with responsibilities including problem-solving using structured methodologies (KT), designing experiments (DoE), line monitoring and yield improvement, data analysis, and using AI tools to maximize learning.

What they are looking for

Design of experimentsKepner-tregoeJmpSystem analyticsData extraction

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