Internship - Understanding the reliability of advanced laminate-based electronic packages at NXP
NXP SemiconductorsNijmegen · Posted Sep 05
Internship for Master of Science in Microelectronics focusing on investigating the reliability of laminate-based electronic packages; involves failure analysis to understand degradation mechanisms under humidity with electrical bias and thermo-mechanical loading, and collaborating with NXP's Product Quality & Diagnostic Center (PDQC) to define reliability test methods and evaluation strategies in a multinational environment (Nijmegen, Netherlands).
What they are looking for
Details
- Work type
- Onsite
- Remote eligible
- No
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