Lead the research and development of next-generation packaging materials, including epoxy die-attach adhesives, molding compounds for fan-out, SiP, and other advanced packages, and underfill materials. Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans. Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility. Also work on developing and qualifying 2nd source suppliers domestically to ensure a resilient, cost-effective, and high-quality supply chain for advanced semiconductor packaging.
What they are looking for
Details
- Work type
- Onsite
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